Thermally conductive double-sided tape is an industrial bonding material composed of acrylic polymer blended with thermally conductive ceramic powder and silicone adhesive; it is primarily used to secure heat sinks to chips in sectors such as consumer electronics, electrical appliances, and LED lighting. Available with either a fiberglass cloth carrier or as a carrier-free (transfer) tape, the material offers excellent flexibility, compressibility, and conformability. It features a thermal conductivity of 0.8–1.6 W/m·K and insulating properties with a volume resistivity exceeding 10¹³ Ω·cm, with an operating temperature range of -20°C to 180°C (up to 288°C for short durations).
By filling the gap between the heat source and the heat sink, it ensures a tight fit and serves as an alternative to traditional mechanical fastening methods. The product is available in two types: with a carrier (long-term temperature resistance of 120°C) and without a carrier (long-term temperature resistance of 220°C), with thicknesses ranging from 0.1 mm to 0.5 mm. To optimize bonding performance, it is recommended to apply 10–30 psi of pressure to the assembly at room temperature for a set period. Typical applications include bonding LED aluminum-based heat sinks, mounting computer processor thermal modules, and securing heat transfer components on power conversion PCBs. The product maintains its performance for 12 months under standard storage conditions and complies with UL-QOQW2 safety certification standards.